Mark,

There are many ways to accomplish this.

My development flow would be:
1. How much of what type of blind/buried vias are done now?
2. Is the technology homegrown or is the technology purchased? (same
questions
for the technology vendor including what type of resources are available to
train the purchaser of the technology)
3. What is the general technology level of the shop?
4. What is the process flow for the b/b process?
5. Get stability/capability data for the processes. Make sure there is
enough
data and the data has maximum variability.
6. What was the qualification plan to introduce the technology?

The general yield or reliability problems will depend on the technology
used,
but if a process is stable and capable just ask for the qualification plan
and
see if it meets your requirements.

In general, those shops that are capable of providing a reliable product
will
have much if the data above. And the key word is DATA.

Steve

Hello Technet,

Our company is busy designing some printed circuit boards with
"overplated blind via's" (I mean blind via's, made in a sequential
plating process, where the via is filled with epoxy, after which it is
covered with copper and a solderable plating).
All our vendors claim they can build such boards, but as far as I
known they do not use this technology very often,  and I don't want to
be their "guinea pig".
The question :
What kind of questions should I ask our bare board vendors in order to
check wether they are capable of building these boards with good
relaibility in a reproducible way ? What are the potential problems
that the board vendors should be aware of, and should have solved ?
Any ideas ?

Mark Roach

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