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June 1998

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Subject:
From:
David Gonnerman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 16 Jun 1998 13:56:35 -0500
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text/plain
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text/plain (114 lines)
Sorry - I don't mean to advertise - but you can get this paper (or the
entire proceedings) from us.  Reprints of SMTA papers are free for our
members.

-David


At 12:06 PM 6/16/98 -0500, you wrote:
>Hi Steve - take a look at the following paper:
>
>"Ball Grid Array, MicroBGA, Chip Scale Packaging, and 0.4mm  Ultra Fine
>Pitch Implementation At US Robotics", author Ron Evans, et al, pages
>141-163, SMTA National Symposium "Emerging Technologies" Proceedings,
>October 1997"
>
>The paper contains some good information on ball grid array pad design and
>manufacturing interaction issues that may be relevant to your issues. Good
>Luck.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
>
>"Joy, Stephen C" <[log in to unmask]> on 06/16/98 11:33:00 AM
>
>Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
>      to "Joy, Stephen C" <[log in to unmask]>
>
>To:   [log in to unmask]
>cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
>Subject:  [TN] Solder mask profile information
>
>
>
>
>     We have been having some problems with a BGA device where we see
>     ball fatigue (solder ball cracks) after temp cycling. We think it
>     may be related to severe undercut of the solder mask.
>
>     Does anyone have information on different solder mask foot
>     profiles? How difficult is it to get a straight sidewall on
>     solder masks?
>
>     Are there any that are much better than others for this
>     attribute? What would be the trade offs?
>
>     You can contact me off line if you prefer.
>
>     Steve Joy
>     503-696-2239
>     [log in to unmask]
>
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>

David Gonnerman
Director of Publications

Plan now to attend:
Surface Mount International (San Jose, CA; 8/23-8/27)
Electronics Assembly Expo (Providence, RI; 10/24-10/29)

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