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June 1998

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Subject:
From:
"Joy, Stephen C" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 16 Jun 1998 09:33:00 -0700
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     We have been having some problems with a BGA device where we see
     ball fatigue (solder ball cracks) after temp cycling. We think it
     may be related to severe undercut of the solder mask.

     Does anyone have information on different solder mask foot
     profiles? How difficult is it to get a straight sidewall on
     solder masks?

     Are there any that are much better than others for this
     attribute? What would be the trade offs?

     You can contact me off line if you prefer.

     Steve Joy
     503-696-2239
     [log in to unmask]

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