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June 1998

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Subject:
From:
"Eltek Ltd. - Process Engineering" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 16 Jun 1998 07:32:43 +0300
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Bill,
Write little bit more about your process ( vertical , horizontal , surface
preparation , process control , etc )
regards

At 07:57 15/06/98 -0700, you wrote:
>Yo techies! Has anyone out there had experience with Ethone-OMI's Enteck
OSP? We're using it here as we have some 0.4mm pitch devices & have had
problems managing the thickness of the OSP. We see residues which causes
non-weeting on the pads, & the gold edge connector still had enough OSP left
to cause connection problems. Any help would be greatly appreciated...
>
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Edward Szpruch
Eltek Ltd - Israel
Tel  972 3 9395050
Fax 972 3 9309581
E-mail :  [log in to unmask]

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