Eddie, at this point I don't have pad/layout information; however I can tell
you what we're planning to use in order to place these devices.  So,
assuming that pad design and layout are "standard" for these packages, maybe
someone may have some ballpark numbers that I can run a "sanity check"
against when we prototype.
Here's what we're placing the devices with:
0402 - Fugi CP6
25 mil SMT Connectors - Universal GSM
16 mil qfp - Universal GSM

If more information is required, let me know and I'll get it.

> -----Original Message-----
> From: Eddie Brunker [SMTP:[log in to unmask]]
> Sent: Monday, June 01, 1998 2:23 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] 25mil SMT connectors, 16mil TQFPs (14mm package),
> 0402 chips
>
> Hi,
>
> This depends on you. You must create your defect levels at the design
> stage.
> Your pad geometries, board layout and the level of investment in equipment
> with suitable capabilities are factors which will determine this.
> If you provide more information, we can go deeper than this.
>
> Regards
>
>
> At 15:59 29/05/98 -0400, you wrote:
> >Hi, we are planning to start assembling PCBAs with the following
> >technologies:
> >*       25mil SMT connectors
> >*       16mil TQFPs (14mm package)
> >*       0402 chips
> >
> >I'm interested in knowing what kind of placement/soldering defect levels
> are
> >associated with each of these packages.  Any help would be appreciated.
> >
> >Yves Trudell
> >Nortel, Wireless Networks Calgary
> >Quality System Engineering
> >
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