Hi Nicolas,

You will need to establish a contamination history, by analytical analysis
of the solder, < 0.15%  Au b.w., is usually recommended. Board count can
then be used, but still only as a guideline, analytical analysis of the
solder should be your determining factor. Also, please keep in mind, solder
joint failure will result, if the gold thickness is greater than 12
microinches.


Lenny Kurup
EMX Enterprises Ltd.


On Mon, 15 Jun 1998, Nicolas van der Heyden wrote:

> I Technetters,
>
> I have a question about the Gold-Nickel coating.
> I want to know if I will have a gold contamination
> problem in the solder wave?
> If yes, how I must calculated the number of
> boards wich pass before I must change the solder?
> (or time..)
>
> Note: I have an automatic solder refiller and I also
> Know the limit of gold (0.2%, ANSI/J-STD-001A table 5.1)
> but that's all!
>
> Thanks for all for your help
>
>
>                           ,,
>                        ( . . )
> ----------o00---O---00o----------------------------------
>          Nicolas van der Heyden
>
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