Dear Sir,

     Some silver-filled conductive epoxies in the market claim to be solder
     replacement, but successful use of these material require a very good
     understanding of the epoxies properties, the process and CTE mismatch.

     The epoxy can be deposited to the pad by stencil printing or
     dispensing,

     Dispensing process has the tailing problem which can cause short for
     0402 chip resistor/capacitor.  It is very difficult to form the fillet
     for epoxy, because the epoxy may have a gap between the side of chip
     resistor/capacitor and dot peak of epoxy.  How much should the
     placement force be applied and how big should the dot size for 0402
     resistor/capacitor?

     I like to discuss the above-mentioned issue in the TECHNET

     Eden

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