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June 1998

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Sat, 13 Jun 1998 09:40:43 EDT
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Toni
It is difficult to believe that your problem is caused by
moisture in the bare boards, since you have performed
surface mount soldering operations and that raises
the temperature of the board above 100C during the
soldering.

If you clean your boards after surface mount soldering
operations, you could be leaving moisture in the plated
through holes and this is what is causing the outgassing
explosions of solder.  I would look at this first.

The other source of outgassing would be bare boards with
voids in the plated through holes (component and via) which
allow outgassing of the laminate during soldering temperatures.

Check and see if your boards were bought to a specification
such as IPC-RB-276 or IPC-6012.  This would require your
board supplier to do thermal stress/microsections to assure
the quality of the boards prior to shipment.  Contact them
and ask to see the microsections or do your own through holes
which exhibit outgassing.

Susan Mansilla
Technical Director
Robisan Lab

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