Question????

     To add to the mix, Nickel-Gold provides excellent coplanarity for
     surface mount over HASL, however, what about solid solder deposition
     technology.  I understand you can still have the tin lead finish and
     the sluggishness hurdle, how I feel on Mondays, of the gold can be
     overcome plus any wetting problems.

     If in your total flow you have regressive flow costs utilizing HASL or
     nickel-gold, would the cost of a Sipad, Cipad, PPT, or imprint style
     solid solder deposit still be worth the change.  It would seem
     implementation of SSD would also set a manufacturing process up for
     future finer pitch for smaller, lighter, cheaper, faster scenarios.

     Well, did I say enough right, wrong, and middle of the road to stir up
     everyones thoughts and opinions.  If so, great, teach me.  I not to
     old to learn.

     I am at the start of looking into comparisons of nickel-gold vs HASL
     vs SSD technology.  All things considered, what's the best for fine
     pitch?  Mixed technology? . . .


     Ron Hollandsworth
     ITT A/CD
     [log in to unmask]

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