For all who will be in the San Jose, CA area Jun 25


     SMTA Technical Meeting open to all

     2 speakers

     1) Conductive Adhesive Enabling Role in SMT and Flip Chip

     Dr. Ken Gilleo, Director of Technology at Alpha Metals (Cookson)
     Semiconductor Group, Rhode Island


     2) Polymer Flip Chip PFC: A Technology Assessment of Solderless Bump
     Processes and Reliability.

     Richard H. Estes, VP of Technical Operations, Polymer Flip Chip
     Corporation


     Location:  Sunnyvale Hilton Hotel
                Champagne Room
                1250 Lakeside Drive
                Sunnyvale, CA 94086
                (408)738-4888

     Non Member with reservations $25
     Non Member without reservations $30

     Dinner is Chicken Teriyaki or Pasta Primavera

     Reservations: Contact Amy Driban via fax at (408)321-8314 before Noon
     pdt, June 22.


     Abstract:

     1) Conductive adhesives have long served the electronics industry as
     the preferred materials for die attachment. These metal-filled
     polymer-based composites have also played a key role for the ceramic
     hybrid circuit industry.  More recently, specially formulated products
     have been used to solve problems in the printed circuit and packaging
     industries.  This presentation will focus on the solutions offered by
     adhesives to polyester flexible circuitry, SMT assembly of
     temperature-sensitive components and Flip Chip Bonding.

     Polyester-based flexible circuits offer the lowest cost, the cleanest
     process and simplest manufacturing of any method yet commercialized.
     Hundreds of millions of low cost products have been made with
     polyester by the Polymer Thick Film (PTF) process. Component assembly,
     however, is only practical with low temperature conductive adhesives.
     The processes will be briefly described using actual case histories.
     Today, most of you are using products made with conductive adhesives.
     Find out what they are!

     A number of Flip Chip applications have adopted conductive adhesives
     as the preferred joining material.  Two significant emerging areas are
     memory modules and RFID (Radio Frequency Identification) products.
     Each area benefits from the unique properties offered by adhesives
     compared to conventional solder.  The materials, new processes and
     products will be described with generous use of graphics.

     2) Today Flip Chip Interconnect Technology is gaining momentum rapidly
     as the microelectronics Industry strives to meet the challenges of
     increasing circuit speed density and function without sacrificing size
     and weight of module assemblies.  Increasing the number of I/O
     connections on a semiconductor device to the levels needed for the
     next generation of electronic packaging will require significant
     changes in circuit design, bond pad layout and the method of
     interconnect used to make the electrical connections.  This paper
     describes the work being conducted on solderless Flip Chip bump
     process technology as a method for making electrical connections
     between semiconductor chips and circuit substrates.  Comparisons are
     made to "solder bump" Flip Chip processes, reliability and
     applications data are presented on circuits fabricated with the PFC
     Process.  As a final topic data on Flip Chip underfill and future
     applications is presented.

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