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June 1998

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Subject:
From:
"Parvez M.S. Patel" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Jun 1998 21:41:19 -0400
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hey scott so am i..

PARVEZ M.S. PATEL                             ADDRESS:
GRADUATE STUDENT,                             APT.#2, 22 FLORAL AVENUE,
SYSTEMS SCIENCE AND INDUSTRIAL ENGG.          BINGHAMTON, NY-13905
STATE UNIVERSITY OF NEW YORK,                 NEW YORK. U.S.A.
BINGHAMTON-NY.

PH:607-770-7507

EMAIL:[log in to unmask]
      [log in to unmask]

URL:bingweb.binghamton.edu/~bg22842

On Tue, 9 Jun 1998, Scott Martin wrote:

> Hello techies!
>
> I am currently looking for any comparison studies on the solderability
> of fine pitch components (20-25 mil pitch) onto various board finishes
> including OSP, Immersion Gold, and HASL.  Any help would be very
> appreciated!
>
> Scott
>
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