hi all,
i am a graduate research asociate at SUNY-Binghamton..looking into
PCB related issues.
I was wondering if anyone of u have observed or have some idea about
the extent that the variation in pad geometry will have on a way a solder
bump deposits/flows on it. the variation in pad geometry is as observed
across different metallizations/plating for the same pad diameters.
thanks in advance
regards


PARVEZ M.S. PATEL                             ADDRESS:
GRADUATE STUDENT,                             APT.#2, 22 FLORAL AVENUE,
SYSTEMS SCIENCE AND INDUSTRIAL ENGG.          BINGHAMTON, NY-13905
STATE UNIVERSITY OF NEW YORK,                 NEW YORK. U.S.A.
BINGHAMTON-NY.

PH:607-770-7507

EMAIL:[log in to unmask]
      [log in to unmask]

URL:bingweb.binghamton.edu/~bg22842

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