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June 1998

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Subject:
Re: BGA periphery clearance
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Jun 1998 12:52:00 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (27 lines) 
We use a .200" keep out area, which we do need occasionally.  The problem isn't
with assembly defects but with component function.  Our BGAs are complex
multi-chip modules that occasionally perform differently when tested in a
socket then when soldered to an assembly.  The point is it depends on how much
rework you think you'll have.  If it is a simple device and you have a
controlled process, then the risk is low.  On the other hand, if you have a
complex component or your process is so-so, then maybe you should include the
keep-out area.

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


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