Ralph:
I have seen this done on a 8-pin plastic DIP package where the manufacturing guys converted a DIp to a surface mount part. The package integrity wasn't compromised, but the application was pretty benign (hard disk drive). The only problem we had was maintaining coplanarity. Since we made the modification and not the IC supplier, we had to eat all losses becuase of this.

Early on, we did experience some lead breakage, but we found that this was caused by us bending the lead at the narrow part of the pin (where it would normally go into the feed through); we resolved this by forming the parts at the shoulder (read: thicker) part of the device.

Almost sounds like a standard SMT package would be better...

Hope this helps...

Dr. Bill

> -----Original Message-----
> From: Vaughan, Ralph H [SMTP:[log in to unmask]]
> Sent: Monday, June 01, 1998 5:42 AM
> To:   [log in to unmask]
> Subject:      [TN] CCA MOD
>
> Hi Guys,
>
> I am looking for some tidbits of info, mainly, I think, from folks in
> the component (IC) fab business. We are proposing a mod to a completed
> circuit card whereas we need to insert a resistor between a thru-hole
> DIP lead and another part.  We would like to cut the DIP lead flush to
> the board on the component side, bend the lead out about 45 degrees, and
> hook and solder the jumper lead to it.  (There are reasons we can't get
> to the back side of the board).  The two concerns are lead breaking and
> compromising the hermeticity of the package.  I know the glass frit is
> pretty tough,  so do we have a good safety margin after this mod?
>
> tia (thanks in advance)
>
> Ralph
>
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