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June 1998

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Subject:
HEAT DISSIPATION design for power resistors
From:
Byrns Nancy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Jun 1998 09:18:01 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
> Hi Technetletter
>
> We presently use a thermal plane with a direct contact of a 3 watts
> resistor for heat dissipation.
> Our board (class 3 military) was fabricated in 1986, we want to know
> if IPC require to use a thermal mounting plate and we want to know if
> we can still use the old method. I would like to know if
> manufacturers/designers have a guideline for this problem.
>
> Nancy Byrns
> Oerlikon Aerospace
>

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