TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Peggi Blakley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Jun 1998 07:15:14 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines)
Mr. Mansfield
        You are correct, in the IPC-7711 there are no procedures for this process,
however as the co-chair for this document, I welcome your input, and would
suggest that you forward them to me.  I will in turn take them to the fall
works meeting in Providence for committee review.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Matthias Mansfeld
> Sent: Wednesday, June 10, 1998 5:16 PM
> To: TechNet
> Subject: [TN] Future new Procedures in IPC-7711
>
>
> Hello TechNetters,
>
> in IPC-7711 (Rework of Electronic Assemblies) are no procedures for
> modifications like insertion of additional components which have no
> corresponding lands in the layout. I think this happens very often
> during the prototyping phase or the very first production runs. I
> know some companies which have procedures (how to fix these parts,
> where to place/not to place them, stacked mounting of chip Rs and
> Cs and so on). Is it planned to publish with the next updates such
> procedures? Perhaps I could get the permission from at least one of
> my customers to send his procedures to someone at IPC, however, it is
> absolutely not in the IPC-7711 style. But maybe it has some good
> ideas.
>
> Regards
> Matthias Mansfeld
> -----------------------------------------------
> Matthias Mansfeld Elektronik
> * Printed Circuit Board Design and Assembly
> Am Langhoelzl 11, D-85540 Haar, GERMANY
> Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
> E-Mail: [log in to unmask]
> Internet: http://home.t-online.de/home/matthias.mansfeld
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
> additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask]
> or 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2