One other suggestion is to put labels on your I.C.s. You could write
whatever you want and remove it when needed too. As long as they sustain
your process and their expected life environment, and that they don't
cause any unexpected problem, labels should work fine. There's an IPC
technical committee that is currently writing a spec on this issue.

Richard Blanchet
Process Engineer, screening
Viasystems Canada Inc.
tel.: (514) 694-8900, ext. 4189
fax: (514) 694-9776
[log in to unmask]

> -----Original Message-----
> From: Stephen R. Gregory [SMTP:[log in to unmask]]
> Sent: 10 juin, 1998 22:08
> To:   [log in to unmask]
> Subject:      Re: [TN] IC top mark
>
> Edwin,
>
>      I must say, I see a lot of posts from others about how to prevent
> I.C.
> markings from coming off during the assembly process, but yours has to
> be the
> first one I've seen asking how to remove the marking...are you sure
> you want
> to do that?
>
>      I just say that because I know there was a big stink a while back
> about
> some "shady" companies re-marking parts to indicate that they
> performed faster
> than they actually were...I'm not insinuating that you are doing that,
> but it
> is unusual that one would want to remove the permanent marking from a
> IC.
>
>      But to give you some info, instead of removing the marking, why
> not cover
> it? A silkscreen and some black epoxy ink works just fine...
>
>                               -Steve Gregory-
>
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