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June 1998

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Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 11 Jun 1998 03:52:56 EDT
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In a message dated 98-06-10 15:16:49 EDT, you write:

<< What is the cause of shadow plating between the pad and the surrounding
 solder mask?
  >>
Gabi:

The problem is almost certainly one of absorbtion of the Palladium catalyst by
the soldermask/substrate.  This is a not uncommon problem of fabricators using
the old colloidal Palladium/Tin style catalyst, which was originally developed
to catalyze the electroless Copper plating systems, for the EN/Au plating
system.  The trouble is that this type of  catalyst works TOO well, and can
catalyze the organics present, as well as the bare Copper.

It is possible today to get from a number of vendors, RD Chemical among them,
a solution (rather than a collodial) catalyst, which catalyzes ONLY bare
Copper, and will not allow plating on the organic part of the substrate.

Please contact me directly, not through Technet, if you would like more
information.

Rudy Sedlak
RD Chemical Company
Fax +(650) 962-0370

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