>Hello,
>
>IPC Spec. 4101, Specifications for Base Materials for Rigid and Multilayer
>Printed Boards, does not address epoxy spots.  Does anyone know of a
>specification that addresses epoxy spot acceptability criteria?
>
>Thank you for your answers,
>
>Joel Fillion
>Matsushita Electronic Materials
>

Actually, paragraph 3.8.3.1.6 b. refers to metal residues on etched cores.
This is a residual (no pun intended) from the old MIL-S-13949 and MAY
implicate resin or epoxy spots on the surface. In the past no one (ie the
laminate vendors) wanted to fail this requirement due to the repercussions
of failing the MIL tests. Consequently, should you ask for the records and
audit the actual process used to etch the foil, you will find that the test,
in reality, means very little.

I hope that with the adoption of IPC-4101, the laminate vendors will use an
appropriate etching process and apply statistical methods to the number of
residual spots and establish improvements based upon the data in accordance
with para. 4.5 of the same specification.

As far as specific requirements, we at Viasystems Canada have established
specific epoxy spot inspection methods and product requirements involving
black light. I would be more than happy to share this with you if you feel
that this would be of benefit.

regards

Dave Rooke
Viasystems Canada - Pointe Claire

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