TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Chris Rucinski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Jun 1998 16:22:12 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
TechNetters,

Is there chemistry available to remove oxidation
from gold tips without compromising
solderability?

More specifically we have a costumer that has
sent back some boards that have been stored
for almost a year.  The gold tips are tarnished.
The customer has requested that we rework the
boards, without out buffing the gold out.  An
analysis of the thickness gives 40 microinches
of gold on 300 microinches of nickel.

Many thanks,

Chris Rucinski
Process Eng.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2