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June 1998

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Subject:
From:
"Cash, Alan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Jun 1998 18:33:59 -0400
Content-Type:
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Repair and Modifications are covered in IPC 7721 (Repair and Modification of
Printed Boards and electronic assemblies).  Send the procedures to Jack
Crawford at the IPC.

    Al Cash
> ----------
> From:         Matthias Mansfeld[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Matthias Mansfeld
> Sent:         Wednesday, June 10, 1998 6:16 PM
> To:   [log in to unmask]
> Subject:      [TN] Future new Procedures in IPC-7711
>
> Hello TechNetters,
>
> in IPC-7711 (Rework of Electronic Assemblies) are no procedures for
> modifications like insertion of additional components which have no
> corresponding lands in the layout. I think this happens very often
> during the prototyping phase or the very first production runs. I
> know some companies which have procedures (how to fix these parts,
> where to place/not to place them, stacked mounting of chip Rs and
> Cs and so on). Is it planned to publish with the next updates such
> procedures? Perhaps I could get the permission from at least one of
> my customers to send his procedures to someone at IPC, however, it is
> absolutely not in the IPC-7711 style. But maybe it has some good
> ideas.
>
> Regards
> Matthias Mansfeld
> -----------------------------------------------
> Matthias Mansfeld Elektronik
> * Printed Circuit Board Design and Assembly
> Am Langhoelzl 11, D-85540 Haar, GERMANY
> Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
> E-Mail: [log in to unmask]
> Internet: http://home.t-online.de/home/matthias.mansfeld
>
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