Hello TechNetters,

in IPC-7711 (Rework of Electronic Assemblies) are no procedures for
modifications like insertion of additional components which have no
corresponding lands in the layout. I think this happens very often
during the prototyping phase or the very first production runs. I
know some companies which have procedures (how to fix these parts,
where to place/not to place them, stacked mounting of chip Rs and
Cs and so on). Is it planned to publish with the next updates such
procedures? Perhaps I could get the permission from at least one of
my customers to send his procedures to someone at IPC, however, it is
absolutely not in the IPC-7711 style. But maybe it has some good
ideas.

Regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://home.t-online.de/home/matthias.mansfeld

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