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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 10 Jun 1998 08:20:58 -0700 |
Content-Type: | text/plain |
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Gregory S Bartlett wrote:
>
> Hello,
>
> A general question:
>
> How are people ensuring that a laser drilled microvia has no remaining
> resin on the innerlayer copper target pad prior to metallization?
>
> Many thanks in advance!
>
> Greg Bartlett
> Teledyne Electronic Technologies
> Hudson, NH
> [log in to unmask]
>
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> ################################################################Hi Greg,
Depending on the resin system, a permanganate desmear cycle should work.
You may have to make some adjustments in the actual dwell times,
concentrtations and temperatures.
Good luck.
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
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