TECHNET Archives

June 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
PCB finish comparison studies
From:
Scott Martin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Jun 1998 16:22:33 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Hello techies!

I am currently looking for any comparison studies on the solderability
of fine pitch components (20-25 mil pitch) onto various board finishes
including OSP, Immersion Gold, and HASL.  Any help would be very
appreciated!

Scott

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2