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June 1998

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Subject:
Assy: Component Date Code Policy for No-Clean Processing
From:
Sherman Banks <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Jun 1998 13:25:54 -0700
Content-Type:
text/plain
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text/plain (31 lines) 
We are currently planning implementation of a no-clean process and a few
questions have come up.

What should the shelf life policy be to assure solderability of
components when soldered with no-clean fluxes?

Do manufacturers tend to allow the same shelf life regardless of the
flux?

Does it make a difference if nitrogen purge is used?

If so, what is the difference in the required?

Thanks in advance
REGARDS
Sherman Banks
[log in to unmask]
408/481-6047

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