TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Thexton, Duane" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Jun 1998 07:05:03 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (70 lines)
Is there a reason you are not spraying or selectively coating (e.g.,
Nordsen coater) your boards?  Your labor will decrease, as will your
defects.

I would also suggest evaluating different solvents and/or a new coating
if you must dip and are having too many bubbles.  Humiseal 1B73-LOC
worked reasonably well for me.

Duane Thexton
Aerojet
626-812-1894

> ----------
> From:         Cory and Lise Steeby[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Cory and Lise Steeby
> Sent:         Tuesday, June 09, 1998 3:24 AM
> To:   [log in to unmask]
> Subject:      [TN] dip conformal coating
>
> We are using a manual DIP conformal coating method with an acrylic
> coating
> and building assemblies to the IPC-610 specification.
>
> 1.  Are there other specifications which apply to conformal coating?
> 610
> is brief on the subject.
>
> 2.  Our biggest defect is bubbles in the coating.  We are finding that
> dip
> angle, insertion rate and extraction rates all effect the amount of
> bubbles
> on the finished assembly.  Does anyone have similar experience or
> advice?
>
> 3.  Does anyone know of available dipping equipment and / or drying
> equipment?  Our goal is to be able to dip 250 assemblies per day (1000
> assemblies per day panelized 4 up).
>
> Thank You
>
> Cory Steeby
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
> additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2