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June 1998

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Subject:
Re: 25mil SMT connectors, 16mil TQFPs (14mm package), 0402 chips
From:
Eddie Brunker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 1 Jun 1998 09:22:45 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (53 lines) 
Hi,

This depends on you. You must create your defect levels at the design stage.
Your pad geometries, board layout and the level of investment in equipment
with suitable capabilities are factors which will determine this.
If you provide more information, we can go deeper than this.

Regards


At 15:59 29/05/98 -0400, you wrote:
>Hi, we are planning to start assembling PCBAs with the following
>technologies:
>*       25mil SMT connectors
>*       16mil TQFPs (14mm package)
>*       0402 chips
>
>I'm interested in knowing what kind of placement/soldering defect levels are
>associated with each of these packages.  Any help would be appreciated.
>
>Yves Trudell
>Nortel, Wireless Networks Calgary
>Quality System Engineering
>
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