Hi fellows,

Is there a "specific spec" for solderability of gold plated bare boards
vs tin-lead bare boards ?  In other words, since soldering gold plated
boards generally takes more preheat/dwell time, is the time allowed for
solderability test the same ?  I would appreciate exact references on
this. Thank you.

Richard Blanchet
Process Engineer, screening
Viasystems Canada Inc.
tel.: (514) 694-8900, ext. 4189
fax: (514) 694-9776
[log in to unmask]

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