I have used solder fountains in the past to replace connectors. With the
correct nozzle (specific to part size), only the component is affected.

I have fluxed bottom side of PCB, removed, and replaced 40 pin connectors,
dips... in under 10 seconds on a fountain (set at 450F).

No solder sucking is required if the new part is inserted while all the
holes are melted during a fountain cycle.

Don't use the fountain on coated panels unless you first strip all the
coating from the affected area.

P.S. I never saw the IPC spec.

Aric Parr
[log in to unmask]
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 6/6/98 8:36 AM:
[log in to unmask] wrote:

> All,
>
> I'm Baaack....
>
> Got another one for you all.  We occasionally have a need to
> rework a solder connection or an assembly by removing solder
> from the PTH's.

<snip>

Steve:

My experience is that solder suckers, etc. are satisfactory for components
with leads that move
during solder removal.  Multiple leaded components such as transformers,
some connectors, or
stamped metal shields with rigid leads do not always permit complete
removal of the solder from
the holes.  The residual solder can cause part of the barrel in the hole to
adhere to the lead
when the component is "popped" from the board.

IPC-R-700 listed a solder fountain method for removing components (I
haven't had an opportunity
to review the new repair standard yet).  With this method, the thru hole
component is placed over
a solder fountain to melt all of the joints simultaenously then the
component is removed.  The
holes still require solder removal, but the shorter times and lower board
temperatures necessary
to remove solder from a hole without a component lead result in fewer
lifted lands and damaged
barrels.

Don Vischulis
[log in to unmask]

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