Hi Guys,

I am looking for some tidbits of info, mainly, I think, from folks in
the component (IC) fab business. We are proposing a mod to a completed
circuit card whereas we need to insert a resistor between a thru-hole
DIP lead and another part.  We would like to cut the DIP lead flush to
the board on the component side, bend the lead out about 45 degrees, and
hook and solder the jumper lead to it.  (There are reasons we can't get
to the back side of the board).  The two concerns are lead breaking and
compromising the hermeticity of the package.  I know the glass frit is
pretty tough,  so do we have a good safety margin after this mod?

tia (thanks in advance)

Ralph

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