TECHNET Archives

June 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 7 Jun 1998 10:22:55 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines)
Hi All:  I need some help on the general characteristics of dry film & LPI
solder mask.  Specifically, is there any significant difference in the
dielectric of DF and LPI?  What are the typical dielectric values associated
with each and do these values vary or change as a function of the type of
process used for pwa assembly.
Thanks in advance.  Jim Moffitt

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2