What kind of package are you trying to open? If it is a plastic IC package, then try B&G (used to be on Hangar Dr.) in Watsonville, CA- they have a series of nitric or sulfuric acids decap systems; they also have a line of products for delidding metal can transistors, as well as ceramic IC packages.

Otherwise, for plastic IC packages, you can create a 'dimple' in the center of the IC package and then drip heated nitric (70C) or sulfuric (280C) & hand etch it; for ceramic cased IC's, try edge cutting it first on the frit with a saw blade (best one is from Dremel) heating it inverted on a hot plate and prying the top off with an exacto knife. For delidding metal cans try the Dremel Tool saw blade.

Dr. Bill

> -----Original Message-----
> From: Nick Nicolaides [SMTP:[log in to unmask]]
> Sent: Friday, June 05, 1998 2:31 PM
> To:   [log in to unmask]
> Subject:      [TN] Delidder
>
> During manufacturing and test, occasionally we have parts failing during ICT
> or functional test. We generally send out parts for delidding and can
> evaluate for ESD or EOS. We are looking for a delidding machine and have
> only found one. This was for $33,000 which is too high for the usage. Can
> anyone recommend another delidder for a better price.
>
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