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June 1998

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Subject:
From:
Bill Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Jun 1998 07:47:52 -0700
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Try the IEEE Reliability Physics Annual Proceedings- I seem to remember Dr. Eddy from National Semi writing in that years ago.

regs,
Dr. Bill

> -----Original Message-----
> From: Rob Schetty [SMTP:[log in to unmask]]
> Sent: Friday, June 05, 1998 11:00 AM
> To:   [log in to unmask]
> Subject:      [TN] Components - Exposed Cu on Component Lead Ends
>
> Can anyone direct me to a technical reference detailing the work done to
> show that exposed copper on component lead ends do not pose a solderability
> problem?
>
> I've searched the Technet Archives but only found vague references to a
> Battelle paper with no further details.
>
> Thanks in advance for any responses.
>
> Rob Schetty
> LeaRonal Inc
> Freeport NY  USA
>
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