[log in to unmask] wrote:

> All,
>
> I'm Baaack....
>
> Got another one for you all.  We occasionally have a need to
> rework a solder connection or an assembly by removing solder
> from the PTH's.

<snip>

Steve:

My experience is that solder suckers, etc. are satisfactory for components with leads that move
during solder removal.  Multiple leaded components such as transformers, some connectors, or
stamped metal shields with rigid leads do not always permit complete removal of the solder from
the holes.  The residual solder can cause part of the barrel in the hole to adhere to the lead
when the component is "popped" from the board.

IPC-R-700 listed a solder fountain method for removing components (I haven't had an opportunity
to review the new repair standard yet).  With this method, the thru hole component is placed over
a solder fountain to melt all of the joints simultaenously then the component is removed.  The
holes still require solder removal, but the shorter times and lower board temperatures necessary
to remove solder from a hole without a component lead result in fewer lifted lands and damaged
barrels.

Don Vischulis
[log in to unmask]

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