The only drop test that I'm familiar with is in
the Bellcore standard GR-63 NEBS Requirements.

In it is packaged and unpackaged types of "shock"
or drop tests.  In the packaged tests, the box is
dropped on all surfaces and all corners from a
specified height based on weight.

It goes like this - if you had a packaged device that
wieghed between 0 and 22 lbs, then the drop height
would be 29.5 inches.  Once all the drops are done,
then the device has to pass its functional test again.

Unpackaged drop test by Bellcore is much less.
For the same weight, the height is only 3.9 inches.

Goto

http://www.bellcore.com/

to get more information.
GR-63 costs about $110.00.

Regards,  Doug

Chan, Marcelo wrote:
>
> Hi,
>
> A common practice post assembly of portable electronics is to conduct a 3-feet
> drop onto concrete.... I have a PCMCIA assembly onto which we are require to
> perform that test.... and I have some questions related to that..... Since my
> cards are only 24 mils thick or so and very light, I would like to know if the
> way that the assembly hits the floor is an issue, i.e hits on one of the corners
> vs. on its backside.... is there a widely accepted procedure that I could obtain
> a copy that would clarify this issue....

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