Hi Jason,
Your problem is not addition of copper to the Sn/Pb binary, but CuSn
intermetallic compounds growing through the surface. These are non-solderable,
once oxydized. your HASL layer is too thin and/or your storage time is too
long.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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