Fred,
     
     It depends, are your requirements spec'ing for Immersion or 
     Electroplating a Full board with Gold, Gold Tabs or Select Plate.
     
     If you are plating a Gold Tab region, than your Ni call is a bit on 
     high side.  I would recommend 30-50µin of Ni with your std. Au call 
     out of 20µin.  Also remember, this Au thickness is achievable through 
     Electroplating on a conveyorize line (practical) or submersion process 
     of taping off all other areas except the area to be plated 
     (impractical method).
     
     If it is an Immersion process, then your lucky to get 8-10µin Au. Keep 
     the Ni thickness as shown above.  
     
     It sounds as if you are spec'ing an Immersion process, which the 
     supplier may not have the capabilities of doing.  They may also have 
     to source the boards out.  Depending on what you paid initially, it 
     may not have been enough to cover the outsourcing cost.  The SnNi 
     process is sometimes used as a substitute to NiAu and is also an 
     Immersion Process (similar to Ommikron Process).
     
     Please specify what the end product is and what it is you are trying 
     to plate.
     
     John Gulley
     Inet Inc
     1255 W. 15th St
     Plano, TX 75075
     
     
     
     


______________________________ Reply Separator _________________________________
Subject: [TN] Gold over Tin vs. Gold over Tin-Nickel
Author:  Fred Watt <[log in to unmask]> at Internet
Date:    6/5/98 11:19 AM


Does anyone know what the relative merits/demerits of this are?  We have been 
specifying 20 u" Gold over 100 u" nickel and a new fab vendor is asking if 
tin-nickel is all right.
     
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