TECHNET Archives

June 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Components - Exposed Cu on Component Lead Ends
From:
Rob Schetty <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Jun 1998 14:00:10 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Can anyone direct me to a technical reference detailing the work done to
show that exposed copper on component lead ends do not pose a solderability
problem?

I've searched the Technet Archives but only found vague references to a
Battelle paper with no further details.

Thanks in advance for any responses.

Rob Schetty
LeaRonal Inc
Freeport NY  USA

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2