What impact does the copper content have on the solderability of a HASL'd
board?  We were having solderability problems on one SMT bottomside
component that was sitting on a ground plane.  I am thinking that the
increase in copper content coupled with being on a ground plane would cause
more heat needed to solder the component which is not reached by both
swaying from the eutectic and being on the ground plane.  Another instance
that is observed is that when the boards topside are reflowed, the pads get
a milky looking color to them.  Is this from the copper addition in the
solder?  Does anyone have access to a terinary diagram that would have
these three elements on it:  Pb,Sn,Cu ??  Any additional info would be
nice.

Jason Smith
Process Materials Engineer
Lexmark Electronics

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