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June 1998

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Jun 1998 10:46:15 EDT
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text/plain
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text/plain (31 lines)
Hello Wolfgang,

     As with Cobey, I've not seen solderballs on bare boards. However, I have
seen what one might consider to be solderballs, but it really wasn't
"solderballing" in the normal sense.

     What had occured on the boards I'm referring to was that the fab had been
HASL'ed and then after the fact, the vias were tented with plugs of mask.
During reflow the plating became liquidous and outgassed thru a break in the
mask and a little ball of solder would form, attaching itself  to the via's
anular pad.

       I couldn't build the second side of the board because I couldn't print
with the balls being attached to the via the way they were. But not only that,
the concern was that there would be contaminates trapped inside the tented
vias.

-Steve Gregory-

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