Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 24 Jun 1998 13:29:47 -0400 |
Content-Type: | text/plain |
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Gaby,
Results shown on 16 and 20 mil pitch devices assembled in our 5 assembly
houses with soldermask dams has greatly reduced the number of solder
shorts.
As the manufacturer of the boards for these houses all product with these
smt's
now get 100% dams.
John Haman Jr.
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> From: Gabriela Bogdan <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TN] Solder mask between fine pitch pads
> Date: Wednesday, June 24, 1998 11:09 AM
>
> Hi, TechNetters!
> Could you please share with me your experience about pro and con's
> regarding solder mask
> between fine pitch-16mil- pads in relation to the finish of the PCB pads
> ?
> Not being greedy, I'll save the next question for after some answers.
> Thank you,
> Gaby
>
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