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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 16 Jun 1998 13:40:20 -0600 |
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May be you can keep the mask a comfortable distance away from the solder
joint.
-----Original Message-----
From: Joy, Stephen C [SMTP:[log in to unmask]]
Sent: Tuesday, June 16, 1998 10:33 AM
To: [log in to unmask]
Subject: [TN] Solder mask profile information
We have been having some problems with a BGA device where we
see
ball fatigue (solder ball cracks) after temp cycling. We think
it
may be related to severe undercut of the solder mask.
Does anyone have information on different solder mask foot
profiles? How difficult is it to get a straight sidewall on
solder masks?
Are there any that are much better than others for this
attribute? What would be the trade offs?
You can contact me off line if you prefer.
Steve Joy
503-696-2239
[log in to unmask]
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