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Sender:	TechNet <[log in to unmask]>
X-To:	Tom Lambert <[log in to unmask]>
Date:	Thu, 25 Jun 1998 15:03:45 -0400
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, superflx <[log in to unmask]>
Subject:	Re: Chip Termination Finish
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From:	superflx <[log in to unmask]>
Parts/Attachments:	text/plain (41 lines)

Tom,

There are differences between plate and hot dip soldering.  Hot dip provides a better coverage of
the base with less opportunity for oxide development because of the uniformity of the coating and
less porosity than plating.  Additionally, it gives a better cosmetic finish that is shinier than
plated.

Of course, we are flux manufacturers and biased, but our feelings are also reflected by companies
that used to plate and have switched to soldering.

Phil

Tom Lambert wrote:

> Hi Folks :  I just know many of you out there have knowledge re termination
> finish of chip parts to pass along.  Specifically - is "hot solder dip" any
> better/worse than "solder plate" ??  Thanx.
>
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