Hi folks,
                Does anyone have any information regarding technical issues
     behind soldering SOIC's onto flexible circuits.  We have seen product
     from both wave and I.R. reflow, and although the reflow method gave us
     a much lower level of visual defects, we seem to have more functional
     problems.  Would a wave process subject the assembly to lower /
     shorter temperature stress?

     thanks & regards,
                        John Gibson

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