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Date: | Wed, 24 Jun 1998 14:30:51 -0700 |
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We found out the supplier did some gold plating touch up, and got some
gold on the diode solder joints.
DDL
______________________________ Reply Separator _________________________________
Subject: Re: [TN] Reliability Risk related Electroless Nickel/immersi
Author: "Leslie O. Connally" <[log in to unmask]> at INTERNET
Date: 6/24/98 3:12 PM
Ken,
I experienced the same problem years ago. We traced the problem at that time to
gold porosity, allowing oxidation of the nickel. I don't recall the fix , but I
think we went to 50 microinches of electroplated Gold.
I dont know if this helps or not, Good Luck.
Les Connally
> From: Ken Patel <[log in to unmask]>, on 6/24/98 11:54 AM:
> On my electroless Nickel/immersion gold bare-board, I have seen few places
> with brown/copper looking surface. I have following questions in this
> regards.
>
> (1) Is it due to not having Nickel and gold going directly on the copper
> pads?
> (2) What is the reliability risk after the board assembled if above is
> correct
> I mean gold going directly on the copper pads?
> (3) We have specified immersion gold over Nickel. Looking the color which
> is not 100% copper looking, can immersion gold be plated/applied on
> copper or may be process might be changed to electrolytic gold?
>
> re,
> ken patel
> ______________________________________________________
> Ken Patel Phone: (408) 490-6804
> 1708 McCarthy Blvd. Fax: (408) 490-6859
> Milpitas, CA 95035 Beeper: (888) 769-1808
>
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