Ken,
Gold may not be applied directly on copper in the electrolytic or immersion
plating mode. Gold diffuses into the copper readily. Nickel is a diffusion
barrier and is nessecary to maintain solderability.
Occaisionally the Ni may skip a pad during processing, if the electroless Ni
process is not running in spec. This will result in the "copper colored pad".
This is not be an acceptable defect.
George Milad
LeaRonal Inc
Tel(516)868-8800
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