Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 23 Jun 1998 17:28:51 +0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dear member,
I am going to do FEM simulation for our electronic packaging. There
are several software in the market, such as ANSYS, MARK, ABACUS and
Pro-mechanical. From your experience, which one is better?
I need to simulate the nonlinear material and very fine structure such
as wire and adhesive.
Pls. give me some advice.
Best Regards
Eden
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|