Mark,
You have a valid concern. This type of construction requires some skill
and experience to produce reliable boards.
FYI, we have built in excess of $1 million of this type of product, to
IPC-RB-276 Type 4 Class 3 specs, for flight hardware (source inspected).
The majority of these boards were 15 layer, with blinds from layer 1-14,
and also 12 layer with blinds from 1-10. The hole diameter was typically
.010, so getting proper resin fill was a challenge. They were then plated
over.
I'll be glad to talk with you about this further.
Kent Johnson
UNICIRCUIT
Phone: 800-648-6449
On Tuesday, June 16, 1998 1:23 PM, [log in to unmask] [SMTP:[log in to unmask]]
wrote:
> Hello Technet,
>
> Our company is busy designing some printed circuit boards with
> "overplated blind via's" (I mean blind via's, made in a sequential
> plating process, where the via is filled with epoxy, after which it is
> covered with copper and a solderable plating).
> All our vendors claim they can build such boards, but as far as I
> known they do not use this technology very often, and I don't want to
> be their "guinea pig".
> The question :
> What kind of questions should I ask our bare board vendors in order to
> check wether they are capable of building these boards with good
> relaibility in a reproducible way ? What are the potential problems
> that the board vendors should be aware of, and should have solved ?
> Any ideas ?
>
> Mark Roach
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
> ################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|