Depends upon topography retained after elecroless copper,
1. Neutralise, rinse, scrubb , dry
2. Neutralise, rinse, antitarnish,dry
3. Neutralise , rinse, light pumise scrubb on machine,dry
Final surface must be clean, uniform , acidic , dry
Fulabhai Patel [log in to unmask]
[log in to unmask] wrote:
>
> Jacob Ransborg wrote:
> >
> > Hi technetters
> >
> > I would like to hear if anybody have experience wtith a cleaning process of
> > PCB-boards after plating with electroless copper. Does anybody brush the
> > boards or use a chemical treatment etc.
> >
> > Regards
> >
> > Jacob Ransborg
> >
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> > ################################################################Jacob,
> Most electroless copper deposits are fairly rough in terms of topography
> and generally provide an excellent surface for dry film adhesion.
> Generally, no precleaning after electroless is required if you are going
> directly to imaging.(assume hold times between electroless and
> photoresist lamination is less tha eight hours)
> Depending on deposit thickness, scrubbing is not recommended anyway.
> Good luck.
>
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