We have been having some problems with a BGA device where we see
ball fatigue (solder ball cracks) after temp cycling. We think it
may be related to severe undercut of the solder mask.
Does anyone have information on different solder mask foot
profiles? How difficult is it to get a straight sidewall on
solder masks?
Are there any that are much better than others for this
attribute? What would be the trade offs?
You can contact me off line if you prefer.
Steve Joy
503-696-2239
[log in to unmask]
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